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  • [PDF]

    INotion Doc ID #32928 Specifications subject to ...

    300 mm only or 200 mm only for Edge Handling and BSIM Configurations ... ≤0.001 particles (≥0.12 µm)/cm2/pass backside for edge handling/BSIM only ...

    www.keyassets.com/docs/7088/1550_2.pdf - Similar

  • Rite Track » TEL Retrofit Kits

    Reverser, Edge Handling Chuck, & Edge Handling HP. Add a reverser unit to an open thermal stack area to flip wafer for backside processing ...

    ritetrack.com/products_retrofitkits_tel_other.asp - Similar

  • George Coad Lafayette CA

    George Coad Lafayette CA 6702302 Edge handling wafer chuck. ... An edge handling chuck which operates to maintain a semiconductor wafer at a desirable ...

    www.patents.com/George-Coad/Lafayette/CA/3183618/inve... - Similar

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