Hughes Aircraft Company
Web results:
HRL Laboratories Aims at Unprecedented High-Frequency Performance in Gallium Nitride MMICs Based on Traditional Silicon Semiconductor Fabrication Techniques. HRL Laboratories, LLC, is developing Efficient GaN Integrated G-band Monolithic Arrays (ENIGMA), a project funded by DARPA.
HRL’s Sensors and Electronics Laboratory (SEL) develops state-of-the-art radio-frequency (RF), millimeter-wave, and electro-optical sensor subsystems and components for rapid end-use in the field. Core Competencies. Advanced Apertures.
CURRENT OPENINGS. If you are interested in a career at HRL, you may submit your resume online by following the appropriate job below. Due to the large number of resumes that we receive from various sources, HRL has chosen to only accept employment inquiries submitted through our web-site.
HRL Laboratories; PDF Solutions; Learn more on the Department of Defense website. ...
Researchers from HRL Laboratories, a research center owned by General Motors and Boeing, have developed a novel method of 3D printing parts using fracture-resistant Ceramic Matrix Composites...
In September 2017, a HRL Laboratories team published a paper announcing that they had succeeded in 3D printing a traditionally non-weldable, high-strength aluminum alloy. A feat of ingenuity, the...
HRL Laboratories, a r esearch center owned jointly by General Motors and Boeing, has announced the registration of its high-strength aluminum alloy, paving the way for commercialization of the ...
Malibu, CA – HRL Laboratories, renowned for its cutting-edge research and innovations, is thrilled to be present at the Quantum Information Science (QIS) Career Fair. Mark your calendars for Wednesday, September 13, 2023, and join virtually for an immersive experience powered by vFairs.
HRL Laboratories's annual revenues are $100-$500 million (see exact revenue data) and has 500-1,000 employees. It is classified as operating in the Scientific Research & Development Services industry.
Florian Herrault, PhD, HRL Laboratories, LLC. Summary: New requirements for communication (e.g., 5G) and radar (e.g., automotive) applications at millimeter-wave frequencies have fostered the development of new packaging solutions for circuit and subsystem manufacturing.